Engineering publications brought to you by Mark Allen

New Electronics

Renesas and Nidec delivering advanced integration for EV E-axles

Surface-mount failsafe electromechanical relay switches

TSMC to suspend production of AI chips for China

Collaboration pairs BLDC/PMSM motor controller/driver and ICeGaN ICs

First BLE and Matter wireless MCU to feature neural co-processor for AI/ML workloads

Taoglas AntennaXpert helps engineers select optimal antenna solution

Panasonic and Arm look to standardise Software-Defined vehicles

SolidRun unveils HummingBoard i.MX8M IIOT SBC

Time for the Intelligent Edge

SEGGER SystemView free for select ultra-low power MCUs from Analog Devices

Forefront RF secures £16m to power next-gen connectivity solutions

Advanced galvanically isolated gate drivers feature flexible protection for IGBTs and SiC MOSFETs