Through enhanced system performance the TDM2454xx quad-phase power modules have been designed to enable best-in-class power density and total-cost-of-ownership (TCO) for AI data centre operators.
These power modules enable true vertical power delivery (VPD) and are said to offer the industry's best current density of 2 Ampere per mm 2.
The modules follow the TDM2254xD and the TDM2354xD dual-phase power modules introduced by Infineon last year and continue to enable superior power density for accelerated compute platforms.
In traditional horizontal power delivery systems, power needs to travel across the surface of the semiconductor wafer, which can result in higher resistance and significant power loss. Vertical power delivery looks to minimise the distance that power needs to travel, thereby reducing resistive losses enabling increased system performance.
Data centres are currently responsible for two percent of global energy consumption according to the IEA.
Fuelled by AI, the power demands within data centres are expected to grow by 165% between 2023 and 2030, so continually improving the efficiency and power densities of power conversion from grid-to-core is vital to enable further advancements in compute performance while reducing TCO.
The TDM2454xx modules are a fusion of Infineon's OptiMOS 6 trench technology, its chip-embedded packaging for enhanced electrical and thermal efficiencies, and an innovative low-profile magnetic design.
Additionally, the TDM2454xx has a footprint that is designed to enable module tiling and improved current flow that will help to enhance electrical, thermal and mechanical performance.
The TDM2454xx modules support up to 280A across four phases with an integrated embedded capacitor layer within a small 10x9mm² form factor.
