Engineering publications brought to you by Mark Allen

Embedded Systems

First Bridgeless Totem Pole PFC Evaluation Board

Highly integrated Renesas PMIC optimised for RZ/G2L And V2L MPUs

congatec launches 20 Computer-on-Modules with 11th Gen Intel Core processors

Nexperia releases 80V and 100V ASFETs

IHLP commercial inductor offers high temperature operation

First COM Express Module to feature Intel Core, Xeon and Celeron 6000 processors

ARM Cortex-M4 MCUs for motor control

USB PD 3.1 high-voltage MCU with higher wattage support

FTDI introduces USB power delivery IC Evaluation Board

Bipolar junction transistors in DPAK-package deliver high reliability for automotive and industrial applications

Mercury unveils processing module with integrated AI

ST manufactures first 200mm silicon carbide wafers