Engineering publications brought to you by Mark Allen

Manufacturing

Developer kit based on NVIDIA’s Tegra K1 processor

Southampton project to explore the use of germanium in infrared photonics applications

Package-on-Package (PoP) - PCB Assembly Service

Perovskite material can be a display and solar panel

Re[as]shoringly expensive…

Antimony nanocrystals could enable high capacity sodium-ion batteries

PCB design package is Mentor’s ‘most significant product in years’

Wafer level packaging costs reduced by up to 30% with new approach

Buck regulators address multiple voltage rail requirements

Agilent launches 27GHz PXIe vector signal analyser

Distributor plans to have 300 ARM Accredited MCU Engineers by end of year

MCU power consumption benchmark developed