Engineering publications brought to you by Mark Allen

Electronics

SCORPION: Modular High Current Power Density.

TI to collaborate with UK firm on ‘intelligent’ small cells

Samsung first to offer 64Gbit MLC NAND flash chip

Littelfuse® Transient Voltage Suppressors, Now at Digi-Key

SCANFLEX Gang tester improves efficiency during boundary scan utilisation

IAR Embedded Workbench displays ThreadX captured profiling information

SiLabs introduces first 4-PLL clock ICs

TSMC joins Sematech

Intel to combat smartphone, tablet market with Tri-Gate technology

IAR announces support for ARM application processors

SoC design analysis software gets upgraded for greater efficiency

Dual gate logic aids product miniaturisation