Engineering publications brought to you by Mark Allen

Electronics

OMC delivers flexible fibre optic housing

Teledyne expands technical support for its ADC series

Chipset specific IPDs can help to simplify development of IoT applications

Porotech raises £3m for new generation of microdisplays

Ceva unveils ultra-wideband platform IP

Cadence and Presto Engineering collaborate on IC packaging

STMicroelectronics extends STM32G0 MCU series

Lattice launches CertusPro-NX general purpose FPGA

IAR extends supports for Andes RISC-V processor technology

Blu Wireless’ Mobile Connection Manager looks to boost 5G connectivity reliability

Power Integrations unveils 600 V 12 A Qspeed diode

Renesas announces new family of 700V buck regulators