Engineering publications brought to you by Mark Allen

Electronics

Bidirectional level translator connects SD 3.0 memory with processing hardware

Dialog Semiconductor launches advanced analogue GreenPAK IC

Apple launches MacBook laptops using first in-house designed microprocessor

Micron starts to ship world’s first 176-Layer NAND

MediaTek targets mass market 5G smartphones with Dimensity 700

ASIL B(D) compliance certification for automotive radar, Lidar and V2X DSP IP

UKRI-EPSRC to fund optical integrated circuits research

Bringing NFC wireless charging to consumer devices

Teledyne unveils first direct microwave synthesis DAC

Stewart Connector introduces Category 8.1 cable assemblies

Advantech launches AIR Edge AI inference system

New ecosystem for developing motor control solutions