Engineering publications brought to you by Mark Allen

Electronics

Diodes looks to buy Lite-On Semi

Marvell extends NVMe-oF Ethernet SS technology leadership

High-density 3D stack test chip

Semtech and Murata sampling new LoRa-based modem platform

Winbond memory chip now supports NXP Layerscape LS1012A

Sensorless control pre-driver IC for BLDC motors

Bulgin launches rugged 10Gb/s USB Type-C connector

Scientists create the world's thinnest gold

Microchip delivers analogue embedded SuperFlash technology

Pliops demonstrates revolutionary storage processor

First Rust programming language application for IoT device

BittWare announces strategic investment in Eideticom