Engineering publications brought to you by Mark Allen

Artificial Intelligence

Time to take the plunge

Siemens extends collaboration with TSMC to advance IC and systems design

TSMC and Cadence to deliver advanced-node design flows and 3D-IC solutions

SK hynix begins volume production of 12-Layer HBM3E

Broadcom delivers 200G/lane DSP for Gen AI infrastructure

Samsung develops automotive SSD based on 8th-generation V-NAND

Renesas develops power-efficient 4th-generation R-Car automotive SoCs

NXP’s i.MX RT700 crossover MCU targets AI-enabled Edge

Ceva and Edge Impulse partner to accelerate Edge AI application development

Intel and AWS look to expand strategic collaboration

POET and Mitsubishi Electric to develop 3.2T optical engines for AI networks

SiFive unveils XM Series to accelerate high performance AI workloads