Engineering publications brought to you by Mark Allen

Board Level Design

Embedded systems superheroes at your service!

Nexperia expands Clip-bonded FlatPower packaged diodes with automotive CFP2-HP devices

Trackwise delivers FPC cell-connecting interconnect for EV batteries

Design, development and manufacture

Farnell signs distribution agreement with KUNBUS

Littelfuse battery protectors provide fast response

Penn State to lead study into radiation effects on electronics

Pulsonix PCB Design unveils new capabilities in Version 12.0

SolidRun releases compact LX2-Lite SOM and CLEARFOG Dev Platform

Murata partners with Ignion to help accelerate and simplify IoT design

Avnet Silica gains access to SiP technology through agreement with Octavo Systems

Flex Logix InferX X1M boards target Edge AI vision systems