Engineering publications brought to you by Mark Allen

Semiconductors

Light leverages Cadence Tensilica Vision Q7 DSP for advanced ADAS systems

Toshiba launches high performance Ethernet PCIe bridge IC

VSORA's Tyr chip family targets autonomous driving

Continuous verification

CEVA unveils Bluetooth Dual Mode 5.3 SIG qualified platform

AccelerComm joins Small Cell Forum

Magnachip develops next-generation OLED DDIC for automotive displays

Seeing Machines and Ambarella collaborate on driver monitoring solutions

Meeting the AI/ML design challenge

CEVA unveils NeuPro-M heterogeneous processor architecture

Lattice FPGAs used to power Lenovo Edge/AI experience

First 3MP resolution SoC for automotive cameras