Engineering publications brought to you by Mark Allen

Semiconductors

Graphcore unveils first 3D Wafer-on-Wafer processor

Major advance for co-packaged optics

Imperas unifies RISC-V verification ecosystem with RVVI

Khronos releases Vulkan SC 1.0 Open Standard

Industry leaders join forces to standardise chiplet ecosystem

Re-discover the UK Embedded landscape on 12th May 2022 at the newest and most relevant embedded engineering conference and exhibition.

NXP powers Compal’s integrated Small Cell Solution

ADLINK unveils latest Intel Xeon D-based COMs

GHS and NXP deliver imaging radar solution for L2+ automated driving markets

MediaTek launches Dimensity 8000 5G chip series

Renesas and Fixstars to set up Automotive SW Platform Lab

Renesas announces RZ/Five general-purpose MPUs