Engineering publications brought to you by Mark Allen

ASIC & SoC

PUF solution eliminates the need of enrolment phase

CEVA DSP architecture addresses compute requirements of 5G-Advanced

AMD unveils adaptive computing products and testing services

Socionext introduces 5G direct RF transmitters and receivers

Renesas presents key technologies for automotive communication gateway SoCs

EnSilica to develop satellite communications chip for terminals

Winbond joins UCIe Consortium to support chiplet interface standardisation

The Six Semiconductor announces tape-out of two 7nm test chips

Oculi forms strategic partnership with GlobalFoundries

Cadence delivers 13 new VIP solutions

UK can support semiconductor industry without triggering a subsidy arms race

QuickLogic unveils latest version of its Aurora Development Tool Suite