Engineering publications brought to you by Mark Allen

Semiconductors

STMicroelectronics joins mioty Alliance

Synopsys unveils new validation solution - PrimeLib

Cadence extends Tensilica Vision and AI DSP IP product line

First general-purpose MCU to obtain CMVP Level 3 certification

Renesas and SiFive to jointly develop RISC-V solutions for automotive applications

Automotive-qualified, single-chip solution for ultrawide touch displays

EnSilica completes PPAP on safety-critical automotive ASIC design

Xilinx introduces Kria portfolio of Adaptive System-on-Modules

Mouser and QuickLogic sign global distribution agreement

Avery Design debuts CXL 2.0 System-level VIP simulation solution

BrainChip enters into volume production of Akida AI processor

Why semiconductor design is set to look very different