Engineering publications brought to you by Mark Allen

Semiconductors

SmartBond TINY module looks to demystify IoT development

Flex Logix unveils nnMAX IP

Implementing Bluetooth LE data pumps

Aldec enhances traceability between system and hardware lifecycle data

Cypress unveils IoT-AdvantEdge solutions

NXP’s Wi-Fi 6 portfolio to accelerate adoption across key markets

CEVA unveils high performance sensor hub DSP architecture

Global semiconductor sales fall in February

NXP makes strategic investment in Kalray

Arrow Electronics launches European FPGA Developer Contest 2020

Renesas looks to enable rapid and seamless 'out-of-box' cloud connectivity

Rutronik and HMS Industrial Networks sign distribution agreement