Engineering publications brought to you by Mark Allen

Semiconductors

Intel and ARM set to enable future creativity

Module family unveiled at Embedded World

Ruby Tuesday

Lower current, higher memory

Embedded Linux community unveiled

Mobile phone technology goes into car safety

Module endures extreme temperature ranges

Intel, TSMC collaborate on Atom

Moshe Gavrielov, ceo and president, Xilinx

Acquisition enables commercialisation of metering comms products

Henry Parker, programme manager, technology markets, Intellect

Nitin Sharma, product marketing manager, high speed ADC group, Analog Devices