Engineering publications brought to you by Mark Allen

Electronics

NXP’s S32K3 automotive MCUs ready for AWS cloud services

Amphenol DuraEV e-mobility battery charging/discharging connectors

Renesas partners with EdgeCortix to streamline AI/ML development

Bota Systems raises $2.5m in seed round

Littelfuse announces 800 V N-Channel depletion mode MOSFET

CUI Devices launches thermal design services

HMD starts manufacturing 5G smartphones in Europe

Microchip’s RT PolarFire FPGA achieves QML Class Q qualification

XCAM secures additional UK Space Agency funding for space camera system

Delivering state-of-the-art chip designs

Apple announces plans to hire UK AI staff

Exeger and Matrix Industries to develop low-power solutions for electronic devices