Engineering publications brought to you by Mark Allen

Electronics

3D-IC hybrid bonding reference flow collaboration

NI announces FiRa validation of UWB PHY layer validation and conformance testing

Delivering secure EV charging

Connected device manufacturers turning to new tools and talent to boost productivity

Rambus boosts server memory performance

ST simplifies high-efficiency two-port USB-PD adapters with ST-ONEMP digital controller

Menlo Micro introduces 64 Gbps integrated loopback solution for high-speed data connectivity

HVS awarded funding to develop self-driving hydrogen HGV

OKdo and RS launch next-generation ROCK 5A board

New N-channel power MOSFETs support higher automotive currents

Siemens advances circuit verification with data-driven Questa Verification IQ software

Dual digital interface, multi-channel LED driver meets needs of solid state lighting