Engineering publications brought to you by Mark Allen

Electronics

Microchip extends wireless portfolio reducing barriers to Bluetooth integration

Global tracking and telematics Click board from MIKROE

Diodes provides smart power delivery solutions for digital ICs

Toshiba releases new LDO for ultra-miniature applications

High-power Series 144 reed relays from Pickering switch up to 80W while stacking on compact 0.25-inch pitch

Ask the key questions

MediaTek’s Dimensity 7300 chips target high-tech smartphones and foldables

Arm unveils CSS for Client initiative

World’s first highly integrated multi-mode LTE chipset supporting 450 MHz spectrum

CGD signs agreement with ITRI to develop GaN-based power supplies

imec unveils die-to-wafer hybrid bonding with a Cu interconnect pad pitch of 2µm

Binder expands M12 portfolio