Engineering publications brought to you by Mark Allen

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Machine learning to enable bug free chips

Solutions at hand to test 3D-stacked IC technology

Toshiba develops 3D flash memory with TSV tech

Battery management systems for more reliable EVs and HVs

Ad hoc cache hierarchies make chips more efficient

Design to create a nanoscale multi-colour laser

STMicro partners with Kilopass for OTP NVM memory

Emergence of smart assistants and speakers

Oren Hagai encourages proper RF training

Data infrastructure to make our cities 'smart'

Electrically functional 5nm solution for the back-end-of-line

Mapping a route to mass production of 2D materials