Engineering publications brought to you by Mark Allen

Consumer

Exeger and Matrix Industries to develop low-power solutions for electronic devices

GF and Microchip announce 28-nm SuperFlash memory solution now in production

AI-In-A-Box module performs LLM-based natural language interaction with no internet connection

Bluetooth SIG completes full-stack standard for networked lighting control

OneNav closes $17m funding round

MediaTek develops first chip using TSMC's 3nm process

Halo Microelectronics introduces 3A I2C controlled single-cell battery charger

Chicony selects Ambient Photonics to power sustainable next-generation keyboards

Creative and xMEMS Labs partner to deliver high-fidelity TWS earbuds

Imint debuts advanced stabilisation software

TrendForce predicts PCB market contraction in 2023

The rise of the virtual assistant in retail