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Endura precision timing solution enables faster GPS signal acquisition

Texas Instruments selects Utah for its next 300mm wafer fab

A universal way to assemble stretchable devices in ‘Lego-like’ manner

Will Apple's headset become a reality in 2023?

The promise of a fully connected society

Murata unveils highly accurate soil monitoring system

NTU scientists develop ‘Lego-like’ universal connector

CAP-XX launches ultra-thin prismatic supercapacitor for space-constrained devices

Infineon begins fab construction in Dresden

Bel power converter targets eMobility needs

MediaTek launches the Dimensity 7200

ST introduces ultrasound transmitter optimised for handheld scanners