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Anglia expands power portfolio with UnitedSiC agreement

Protecting rail electronics

KISPE to develop proton testing campaign for next-gen microsatellite technologies

High power density, 10:1 ratio DC-DC converters

ST looks to simplify portable GNSS receivers

Foxconn and Winbond announce strategic investment in Kneron

Ansys' HFSS Mesh Fusion enables the design of entire systems

MediaTek launches Dimensity 1200 Flagship 5G SoC

Farnell unveils Raspberry Pi Pico

Complete EV charge point solution

Qualcomm announces boosted Snapdragon 870 5G mobile platform

Faster 125°C operation compatible EEPROMs extend service life