Engineering publications brought to you by Mark Allen

New Electronics

PUF solution eliminates the need of enrolment phase

Nokia phone maker HMD looks to set up production in Europe

Farnell strengthens distribution agreement with ams OSRAM

Demonstration of 5G integrated reference design leveraging NXP semiconductors

Mercedes teams up with Google

ST reveals NB-IoT industrial modules with GNSS geo-location capability

Infineon presents user-friendly LCC design tool

NVIDIA cuts a ‘dash’ in the AI space

IC’ALPS implements demo-chip designed for Weebit Nano’s ReRAM technology

Qualcomm looks to simplify and accelerate IoT programmes

IAR Embedded Workbench supports STM32 MCU series

CEVA DSP architecture addresses compute requirements of 5G-Advanced