Advanced SMT reworking
A practically focused training course to provide electronics technicians with the necessary skills required in the reworking of complex surface mounted devices. Leeds.
The four day course will train delegates in the techniques needed for board preparation and soldering using lead free and leaded solder and appropriate solder pastes, with a variety of solder compositions.
The first part of the course focuses on quad flat pack or gull wing devices with up to 200pins. The second part is devoted to ball grid arrays and chip scale packages, together with quad flat packs with no leads.
Delegates will acquire the techniques used in the safe removal of failed components, board clean up and preparation, and the 'onsertion' of replacement devices. Emphasis will be placed on the diagnosis of faults that may occur when reworking this range of components, including voids, shorts, insufficient and excessive solder, dewetting, non wetting and misplacement.
