Thermal Management of Electronics Systems

Thermal management has become a critical aspect in the design of contemporary electronic systems. Power dissipation levels have grown due to increased functionality and greater degrees of integration, and careful thermal design is imperative in order to meet today's stringent requirements for reliability. The objective of this short course is to provide electronic designers with an understanding of the principles and practice of thermal management. A theoretical basis is used to establish useful design techniques, and these techniques are illustrated through a set of six practical case studies. The cases span a range of applications from portable devices and consumer products to telecommunications rack systems and industrial power sets. Each case will include a review of relevant theory, and the application of contemporary tools and techniques to achieve a successful thermal design. Who should attend Hardware engineers, particularly those working on high-power or temperature-sensitive applications such as telecommunications, computing or power systems. Engineers and managers with responsibility for the thermal design of electronics. Speakers Dr Jeff Punch directs a research group at the Stokes Institute which tackles reliability-related issues in electronic systems. He has over 15 years' experience in collaborating with the Institute's partners and clients on a range of research programmes. He has published widely on thermal management and reliability physics topics, presenting over 50 invited talks worldwide. The course is on 11-12 March 2009 at Hampton Court, Surrey. Registration To register online for this event, complete this form and press "Submit" (* required field). You will receive an instant notification of your registration. For more information, please email: thora_hallgrimsdottir@mentor.com