Those involved with placement of die and components within the PCB or involved with Die Package and Interconnection Technologies, will have the opportunity to learn about embedded die technology, process tools and flows, materials selection/options, design – industrialisation and applications that are being enabled by embedded die technology.
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Disappearing die – embed your chips
This one-day conference, organised by NMI and IMAPS-UK and held at Mitel Facility in Caldicot, will discuss how embedded die technology can miniaturise, improve performance and reduce cost for applications such as power, wireless and wearables.
