Thermal Management and Reliability of Electronic Systems

This one day event hosted by Wilde Analysis will outline modern methods used in understanding the issue of thermal management in electronic systems along with the tools and processes that are available to predict the reliability of these systems. You will learn about guarding against the risk of component failure which is particularly challenging when: •Other considerations preclude the use of fans and place restrictions on grille design •Your rack-mounted module is competing for air flow in a crowded chassis •You need to design against fan outage Computational fluid dynamics (CFD) is an invaluable technique to quantify component temperatures and visualise air flow. ANSYS Icepak is a CFD based simulation tool specifically designed for the electronics industry, enabling engineers to maximise the use of available air flows and keep temperature-sensitive components within an acceptable envelope. Reliability methods such as FMECA, reliability prediction, life data analysis and accelerated testing can create insight and facilitate risk-based decision making – particularly with small data sets. ReliaSoft has developed an 'out of the box' family of tools that can be used straightaway by design, development & test engineers and reliability practitioners. By attending our seminar, you will understand how CFD and Reliability methods can be combined to influence both product design and through-life product management. The following topics will be discussed throughout the day: • FMECA (Failure Modes, Effects and Criticality Analysis) • Why all product development should start with FMECA • Design out failures • Build a knowledge base of failures from past projects • Component Placement for Improved Thermal Management • Simulate component and system temperatures • Optimise heat sinks and component placement • Improve enclosure design • Reliability Analysis • Calculate reliability using database driven methods (e.g. MIL217) • Determine de-rating factors from temperatures obtained from simulation • Testing • Validate test programmes • Create an accelerated life testing plan • Predict warranty returns • Derive optimum burn-in times • Benefits of Utilising In-Service Life Data • Assess the level of warranty returns • Identify if problems 'in the field' are batch or design issues Who should attend? This seminar is suitable for anyone involved in, or responsible for the design, testing and reliability of electronic systems. Registration/Further information There is no charge to attend this event. For further information or to register, please visit www.wildeanalysis.co.uk. Alternatively you can contact Wilde Analysis on +44 (0) 161 474 7479 or events@wildeanalysis.co.uk.