Mathias Beer, MEN's head of customer relationship management, addressed the need for standards such as VITA 59 at Embedded World. "Besides the general smaller footprint and ruggedisation requirements of today's embedded systems, most also require specific functions to be implemented for various application needs. Ideally, designers look to develop a system with enough flexibility to accommodate future technological upgrades with minimal reengineering costs. But, despite standardisation efforts, these benefits have not been readily accessible for rugged system performance in harsh operating environments. Mobile and safety critical applications face the same constraints as less harsh applications, but the costs of failure are higher."
RCE brings resistance against shock and vibration by screwing the module onto a carrier card and through the use of soldered components (see fig 1). However, MEN says ESMExpress and ESMini products can be even more rugged than RCE through the use of railway and military proven connectors.
ESMExpress products will remain on the MEN portfolio for use by existing customers – 49% of MEN's revenue comes from the rail sector. However, whilst VITA 59 is still at the balloting stage, products are beginning to appear, with MEN at the forefront.
Where increased levels of ruggedness are required – including rolling stock, avionics and military – use of a standard COM Express module is said not to be feasible because of high temperature range, shock and vibration. Typically, volumes are not high enough to make special designs for these kinds of application.
With VITA 59, says MEN, it is relatively easy to modify an existing COM Express module for use in harsh environments by adding PCB wings for mounting inside a dedicated housing.
In this way, MEN continues, it is possible to provide two solutions from one design: a standard module that can be used for price critical applications, and a VITA 59 version that can be used for rugged applications.
MEN points to four major benefits of the VITA 59/RCE approach:
* Reliable operation over temperatures ranging from -40 to 125 °C using conduction cooling.
* The sealed enclosure provides protection against dust, chemicals or humidity.
* Resistance against high shock and vibration effects through the metal block containing the electronics being screwed to the carrier card.
* The aluminium enclosure provides 100% EMC protection.
One of MEN's VITA 59 based offerings is the CB70C, which features a third generation Intel Core i7 processor running at up to 3.1GHz. The module is 100% compatible with COM Express modules featuring Type 6 pin outs and conform to VITA 59.
Schmitz noted: "The Core i7 module comes with up to 16Gbyte of soldered memory; something you won't find with any other module with the same amount of memory."
Another member of MEN's RCE family is the CC10C module, built around Freescale's i.MX 6 applications processor. These modules bring ARM Cortex-A9 processing to the COM world and users can specify different members of the i.MX 6family.
MEN says the CC10C offers I/O flexibility. The i.MX 6 processor features a range of interfaces – including Gigabit Ethernet, USB 2.0 and PCI Express – while video outputs like LVDS and DVI, audio and an optional camera interface make the card suited to multimedia applications. However, if these don't meet the user's needs exactly, an onboard Altera Cyclone IV FPGA allows the COM to be customised. Even when the full quad core i.MX 6 processor is specified, the module can be used in temperatures of up to 85°C.
Schmitz added: "The Intel based module comes in the Basic form factor, while the i.MX device is supplied in the Compact format. But both have Type 6 connectors. Later in 2014, we will be introducing a board featuring the PowerPC. This will be certified to SIL3 and will run Green Hill's Integrity real time operating system, as well as Linux."
Has the move towards RCE/VITA 59 been driven by customers? "Yes and no," Schmitz said. "Some don't care about form factor, but need rugged features. Others want standard products because they can access second sources.
"MEN has a lot of expertise which has been donated to the VITA 59 effort. MEN is the first company to launch a VITA 59 product, but customers will push the industry to develop products based on the standard. In the end," she concluded, "it's an example of VITA and PICMG working together."
Emerging format offers shock and vibration resistance to COM users
4 mins read
Casual observers may scan the reasonably long list of available board formats and conclude there are enough variants to suit every application, no matter how demanding. Yet standards continue to be developed to meet emerging requirements.
One of the more prevalent formats is the Computer on Module (COM), an integrated device that can be used to create systems in much the same way as a component. Each module features a CPU and memory, along with a range of I/O mapped to connectors on the underneath of the PCB.
COM Express, one of the more widely used COM formats, provides a platform for different CPU architectures, such as x86, PowerPC and ARM. The standard has been developed mainly for commercial applications, where there is limited exposure to thermal design, shock, vibration and EMC issues.
Four variants of COM Express have been created: Basic, measuring 95 x 125mm; Compact (95 x 95mm); Mini (55 x 84mm); and Extended (110 x 155mm). Each offers varying support for PCI Express and Ethernet.
Talking at the recent Embedded World exhibition and conference, Michael Plannerer, head of development for embedded system specialist MEN, said: "There are a lot of different form factors and standards for COMs on the market. Some are driven as a proprietary solution; others are driven by organisations like VITA and PICMG. Most standards are designed to provide different customer solutions with a complex CPU board and an adapted simple carrier board for a dedicated application."
MEN broadened this community with the development some years ago of ESMExpress. According to the company, ESMExpress COMs and their smaller relatives ESMini COMs have been developed for applications where robust electronics are required to ensure safe and reliable operation in severe environments.
Using conduction cooling, these fanless COMs were said to enable reliable system design for mission critical requirements. By mounting the module in a frame and enclosing it completely in an aluminium housing, benefits also included reduced EMC problems.
One of the more recent standards to emerge is VITA 59 – also known as Rugged COM Express, or RCE – that draws on ESMExpress. Initially, VITA wanted to create a standard called ANSI/VITA 59 Rugged System On Module Express. However, because ESMExpress was based on COM Express, the designation was changed to VITA 59.00 Rugged COM Express.
The mechanical framework of ESMExpress was retained and the standard now defines what is required to convert standard COM Express boards into devices compliant with VITA 59.
One of the problems, according to MEN's director of marketing Barbara Schmitz was that ESMExpress and COM Express boards had different connectors with different pin outs in different places. "VITA 59 has adopted the COM Express pin out and connectors."
Mathias Beer, MEN's head of customer relationship management, addressed the need for standards such as VITA 59 at Embedded World. "Besides the general smaller footprint and ruggedisation requirements of today's embedded systems, most also require specific functions to be implemented for various application needs. Ideally, designers look to develop a system with enough flexibility to accommodate future technological upgrades with minimal reengineering costs. But, despite standardisation efforts, these benefits have not been readily accessible for rugged system performance in harsh operating environments. Mobile and safety critical applications face the same constraints as less harsh applications, but the costs of failure are higher."
RCE brings resistance against shock and vibration by screwing the module onto a carrier card and through the use of soldered components (see fig 1). However, MEN says ESMExpress and ESMini products can be even more rugged than RCE through the use of railway and military proven connectors.
ESMExpress products will remain on the MEN portfolio for use by existing customers – 49% of MEN's revenue comes from the rail sector. However, whilst VITA 59 is still at the balloting stage, products are beginning to appear, with MEN at the forefront.
Where increased levels of ruggedness are required – including rolling stock, avionics and military – use of a standard COM Express module is said not to be feasible because of high temperature range, shock and vibration. Typically, volumes are not high enough to make special designs for these kinds of application.
With VITA 59, says MEN, it is relatively easy to modify an existing COM Express module for use in harsh environments by adding PCB wings for mounting inside a dedicated housing.
In this way, MEN continues, it is possible to provide two solutions from one design: a standard module that can be used for price critical applications, and a VITA 59 version that can be used for rugged applications.
MEN points to four major benefits of the VITA 59/RCE approach:
* Reliable operation over temperatures ranging from -40 to 125 °C using conduction cooling.
* The sealed enclosure provides protection against dust, chemicals or humidity.
* Resistance against high shock and vibration effects through the metal block containing the electronics being screwed to the carrier card.
* The aluminium enclosure provides 100% EMC protection.
One of MEN's VITA 59 based offerings is the CB70C, which features a third generation Intel Core i7 processor running at up to 3.1GHz. The module is 100% compatible with COM Express modules featuring Type 6 pin outs and conform to VITA 59.
Schmitz noted: "The Core i7 module comes with up to 16Gbyte of soldered memory; something you won't find with any other module with the same amount of memory."
Another member of MEN's RCE family is the CC10C module, built around Freescale's i.MX 6 applications processor. These modules bring ARM Cortex-A9 processing to the COM world and users can specify different members of the i.MX 6family.
MEN says the CC10C offers I/O flexibility. The i.MX 6 processor features a range of interfaces – including Gigabit Ethernet, USB 2.0 and PCI Express – while video outputs like LVDS and DVI, audio and an optional camera interface make the card suited to multimedia applications. However, if these don't meet the user's needs exactly, an onboard Altera Cyclone IV FPGA allows the COM to be customised. Even when the full quad core i.MX 6 processor is specified, the module can be used in temperatures of up to 85°C.
Schmitz added: "The Intel based module comes in the Basic form factor, while the i.MX device is supplied in the Compact format. But both have Type 6 connectors. Later in 2014, we will be introducing a board featuring the PowerPC. This will be certified to SIL3 and will run Green Hill's Integrity real time operating system, as well as Linux."
Has the move towards RCE/VITA 59 been driven by customers? "Yes and no," Schmitz said. "Some don't care about form factor, but need rugged features. Others want standard products because they can access second sources.
"MEN has a lot of expertise which has been donated to the VITA 59 effort. MEN is the first company to launch a VITA 59 product, but customers will push the industry to develop products based on the standard. In the end," she concluded, "it's an example of VITA and PICMG working together."
Mathias Beer, MEN's head of customer relationship management, addressed the need for standards such as VITA 59 at Embedded World. "Besides the general smaller footprint and ruggedisation requirements of today's embedded systems, most also require specific functions to be implemented for various application needs. Ideally, designers look to develop a system with enough flexibility to accommodate future technological upgrades with minimal reengineering costs. But, despite standardisation efforts, these benefits have not been readily accessible for rugged system performance in harsh operating environments. Mobile and safety critical applications face the same constraints as less harsh applications, but the costs of failure are higher."
RCE brings resistance against shock and vibration by screwing the module onto a carrier card and through the use of soldered components (see fig 1). However, MEN says ESMExpress and ESMini products can be even more rugged than RCE through the use of railway and military proven connectors.
ESMExpress products will remain on the MEN portfolio for use by existing customers – 49% of MEN's revenue comes from the rail sector. However, whilst VITA 59 is still at the balloting stage, products are beginning to appear, with MEN at the forefront.
Where increased levels of ruggedness are required – including rolling stock, avionics and military – use of a standard COM Express module is said not to be feasible because of high temperature range, shock and vibration. Typically, volumes are not high enough to make special designs for these kinds of application.
With VITA 59, says MEN, it is relatively easy to modify an existing COM Express module for use in harsh environments by adding PCB wings for mounting inside a dedicated housing.
In this way, MEN continues, it is possible to provide two solutions from one design: a standard module that can be used for price critical applications, and a VITA 59 version that can be used for rugged applications.
MEN points to four major benefits of the VITA 59/RCE approach:
* Reliable operation over temperatures ranging from -40 to 125 °C using conduction cooling.
* The sealed enclosure provides protection against dust, chemicals or humidity.
* Resistance against high shock and vibration effects through the metal block containing the electronics being screwed to the carrier card.
* The aluminium enclosure provides 100% EMC protection.
One of MEN's VITA 59 based offerings is the CB70C, which features a third generation Intel Core i7 processor running at up to 3.1GHz. The module is 100% compatible with COM Express modules featuring Type 6 pin outs and conform to VITA 59.
Schmitz noted: "The Core i7 module comes with up to 16Gbyte of soldered memory; something you won't find with any other module with the same amount of memory."
Another member of MEN's RCE family is the CC10C module, built around Freescale's i.MX 6 applications processor. These modules bring ARM Cortex-A9 processing to the COM world and users can specify different members of the i.MX 6family.
MEN says the CC10C offers I/O flexibility. The i.MX 6 processor features a range of interfaces – including Gigabit Ethernet, USB 2.0 and PCI Express – while video outputs like LVDS and DVI, audio and an optional camera interface make the card suited to multimedia applications. However, if these don't meet the user's needs exactly, an onboard Altera Cyclone IV FPGA allows the COM to be customised. Even when the full quad core i.MX 6 processor is specified, the module can be used in temperatures of up to 85°C.
Schmitz added: "The Intel based module comes in the Basic form factor, while the i.MX device is supplied in the Compact format. But both have Type 6 connectors. Later in 2014, we will be introducing a board featuring the PowerPC. This will be certified to SIL3 and will run Green Hill's Integrity real time operating system, as well as Linux."
Has the move towards RCE/VITA 59 been driven by customers? "Yes and no," Schmitz said. "Some don't care about form factor, but need rugged features. Others want standard products because they can access second sources.
"MEN has a lot of expertise which has been donated to the VITA 59 effort. MEN is the first company to launch a VITA 59 product, but customers will push the industry to develop products based on the standard. In the end," she concluded, "it's an example of VITA and PICMG working together."
