Engineering publications brought to you by Mark Allen

News

Electronics

Finnish consortium participating in Sustronics e-waste and materials project

Manufacturing

KYOCERA Fineceramics Europe doubles its production capacity in Germany

Electronics

Linux announces plans to form High Performance Software Foundation

Artificial Intelligence

Cohesity Turing integration with Amazon Bedrock to provide responsible AI and governance

Distribution

Anglia to supply Digi’s SOM and wireless module solutions to UK customers

Test & Measurement

Tektronix introduces Open-Source Python-native driver package for T&M instrumentation

Electronics

IQM to advance future hybrid quantum applications with NVIDIA

Electronics

Synopsys expands ARC processor IP portfolio with new RISC-V family

Electronics

Nexperia and Mitsubishi Electric to jointly develop discrete SiC MOSFETs

Communications

6G-SANDBOX project signs collaborative 6G research agreement with ITRI

Sensors

Ultra-low noise AFE sensor technology targets wearables

Internet of Things

Kapsch TrafficCom and Exeger to develop sustainable communications systems