Engineering publications brought to you by Mark Allen

News

Electronics

Oxford University spin-out Brill announces successful Series A funding round

ASIC & SoC

Boot up ready prototype chips speed up customer chip testing

Automotive

NXP collaborating with Foxconn on next generation vehicle platforms

Electronics

Longer lasting sodium-ion batteries

5G

Ericsson, Qualcomm and Thales look to take 5G into space

Electronics

Flex Logix partners with Intrinsic-ID to secure EFPGA platform

Memory

Rambus expands DDR5 Memory Interface chips portfolio

Board Level Design

Motor-drive reference designs from STMicroelectronics

Automotive

Inova Semiconductors signs technology agreements with NXP and Microchip

Electronics

Solid State to acquire battery pack manufacturer Custom Power

Automotive

Socionext introduces smart graphic display controllers

Automotive

Tower Semiconductor and Cadence to accelerate automotive IC development