Engineering publications brought to you by Mark Allen

News

Communications Hardware

OMRON launches 3D Time-of-Flight sensor module

CPUs

NXP introduces Wi-Fi 6 + Bluetooth solutions

Wireless Technology

ST introduces first Bluetooth 5.2-certified SoC

Communications Hardware

Alliance to accelerate AR eyewear app development

Embedded Software

XMOS unveils software development kit (SDK) for the AIoT

Memory

X-FAB and Attopsemi look to address 5G memory requirements

Automotive

LDRA to support Arm-based safety critical chips

CPUs

Neural network accelerator chip enables AIoT in battery-powered devices

Research Design

NXP unveils AI Ethics Initiative

Board Level Design

Trackwise looks to significant scaling up of flex PCB production

Research Design

SK hynix launches first DDR5 DRAM

Manufacturing

Renesas announces Arm Cortex-M33-based RA6M4 MCU group