Engineering publications brought to you by Mark Allen

News

RF & Microwave

Xilinx and Continental collaborate on first production-ready auto 4D imaging radar

Manufacturing

Ensemble Graphics Toolkit to speed Linux GUI development

Displays

Supermicro is first-to-market with NEBS Level 3 Certified 1U server

Embedded Systems

Congatec unveils 'state-of-the-art' Computer-on-Modules

Board Level Design

Aaeon launches next generation of embedded solutions

CPUs

Codasip Whitepaper - Creating domain-specific processors using custom RISC-V ISA instructions

Power

Bizen transistor delivers 1200V/75A in a TO247 package

Board Level Design

MathWorks introduces Release 2020b of MATLAB and Simulink

Automotive

ADI collaborates with Microsoft to produce 3D Imaging products and solutions

Automotive

Subaru selects ON's image sensing technology

Research Design

University of Warwick turns to Inseto to evaluate silicon carbide power semiconductors

ASIC & SoC

Kneron KL720 SoC uses a 1Gb LPDDR3 DRAM die from Winbond