Engineering publications brought to you by Mark Allen

News

Research Design

Imec first to stack FinFETS with 45nm fin pitch using sequential 3D integration

Research Design

CEA-Leti extends 300mm wafer line

Automotive

Siemens acquires COMSA

Ultrahaptics raises £35 million in Series C fundraising

Displays

Global demand growth for flat panel displays to slow

Embedded & Programmable

Microchip unveils new class of SoC FPGA

Test & Measurement

Keysight Technologies bolsters support services

Test & Measurement

Battery-powered devices to benefit from a sense of hearing

Board Level Design

Samsung's big semi capex spending keeps pressure on competition, says IC Insights

Board Level Design

CEA-Leti and Silvaco look to develop innovative SPICE models

ASIC & SoC

UltraSoC launches “any processor” lockstep solution for safety-critical systems

Research Design

GLOBALFOUNDRIES announces first 300mm SiGe foundry technology