The ADP500TM platform is a Cortex-A53 based customer-ready architecture including arm subsystems, (NIC-400, SoC-400, GIC-400 and I/Os) and interface IPs (LPDDR4, DDR4, PCIe Gen3 and USB2.0). Using the platform, customers can reduce both time-to-market and make more power and performance optimised ASIC semiconductor chips for automotive, edge AI and consumer products.
The platform’s quad-core Cortex-A53 recorded up to 2.6GHz of outstanding performance with 1.43mm2 of small CPU die size. Its recorded dynamic power was only 66.6mW/GHz (by one Core plus Top) which is an impressive power optimised hardening result.
ADTechnology also said that it will start providing the general arm hardening and implementation service up to leading edge Cortex-A78 cores and its subsystems to global ASIC customers.
“Samsung foundry has been reinforcing our SAFE ecosystem to accelerate customers' semiconductor innovation ranging from artificial-intelligence processors to 5G communication as well as automotive chips." said Mijung Noh, VP of Foundry Design Service Team at Samsung Electronics. "We are pleased to offer this high performance, power efficient 5nm design platform with ADTechnology and ARM, looking forward to seeing wide adoption in the industry"
“We believe Samsung Foundry 5nm is very competitive and there are many opportunities from global customers. So, we will keep evolving and expanding our 5nm platform more to include advanced arm cores and interface IPs so that customers can have more options to choose. With our 5nm platform offering, we hope we could help our global customers’ market success,” said JK Park, CEO of ADTechnology
