PragmatIC Semiconductor develops flexible, integrated circuits and the company's ConnectIC family of radio frequency identification and near-field communications (RFID/NFC) integrated chips can be embedded into packaging to store and relay information to devices such as smartphones.
This technology is being used to enable smart packaging applications across the entire product lifecycle – from manufacturing and supply chain management to consumer engagement and even material recovery.
Frank Lehmann, Vice President Open Innovation and Corporate Venturing at Amcor, said, “Amcor is well-positioned to tap into early-stage, cutting-edge innovation around sustainability and digitisation. We are delighted to partner with PragmatIC Semiconductor to explore ways to leverage and integrate these flexible, integrated circuits into our portfolio of more sustainable packaging solutions.”
Commenting Scott White, PragmatIC Semiconductor CEO, said, “Amcor's investment is a testament to the value Amcor continues to place on innovation and our collective vision on how packaging can be used to connect customers and consumers with the information they need.”
Amcor’s $5 million investment was part of the Series C funding round of more than $90 million for PragmatIC Semiconductor.
