With a greater CPU performance, DRAM memory transfer rate, CPU core count and I/O connectivity when compared to the AMD Ryzen Embedded V1000 series, these new processors are able to deliver the improved levels of performance and low-power options that are required for some of the most demanding 24x7 operating environments and workloads.
Now shipping to leading embedded ODMs and OEMs, the Ryzen Embedded V3000 processors look to address the growing demands of enterprise and cloud storage, as well as data centre network routing, switching and firewall security features and can power a variety of diverse use-cases ranging from virtual hyper-converged infrastructure to advanced systems at the edge.
“We designed AMD Ryzen Embedded V3000 processors for customers seeking a balance of high-performance and power-efficiency for a wide range of applications in a compact BGA package,” said Rajneesh Gaur, corporate vice president and general manager, Embedded Solutions Group, AMD. “AMD Ryzen Embedded V3000 processors deliver a robust suite of features with advanced benefits required for superior workload performance in enterprise and cloud storage and networking products.”
The Ryzen Embedded V3000 processors are available in four-, six- and eight-core configurations with low thermal design power (TDP) profiles spanning from 10W to 54W for storage and networking systems to enable an exacting balance of performance and power efficiency in a compact design. The new processor family enables system designers to leverage a single board design for a wide range of system configurations, with ball grid array (BGA) packaging and low thermal dissipation for the creation of more versatile, flexible designs that ease system integration.
“Storage and networking require a different balance of data processing performance, data movement, power management and thermal management than traditional compute. Processors for storage and networking require compute, memory and I/O capabilities balanced for rack space utilisation, power efficiency and low heat dissipation in space-constrained environments,” said Shane Rau, research vice president, Computing Semiconductors, IDC. “The market for storage and networking will demand x86-compatible processors optimised for core data centre and edge infrastructure systems and processor vendors offering them will help their OEM customers significantly expand their system TAM while leveraging their existing investments in the x86 ecosystem.”
