Engineering publications brought to you by Mark Allen

Semiconductors

Applied Materials accelerates chip defect review with eBeam system

AheadComputing raises funds to support ‘breakthrough’ microprocessor architecture

UK Government urged to speed up National Semiconductor Strategy implementation

Renesas debuts ultra-low-power RA4L1 MCUs targeting IoT sensing and HMI applications

Siemens delivers automated design flows for TSMC 3DFabric technologies

Funding to boost Europe's semiconductor production

Synopsys expands Hardware-Assisted Verification portfolio

Infineon releases first silicon carbide products based on 200 mm SiC wafer manufacturing technology

Siemens now offers advanced silicon IP through Alphawave Semi partnership

OpenAI reportedly on verge of finalising in-house AI chip design

Mouser shipping STMicroelectronics’ NPU-accelerated STM32N6 MCUs

CEA-Leti FAMES pilot line extends research opportunities