“The demand for reliable, robust and power efficient designs increases in a smart connected world as many devices will have to operate in energy-constrained environments,” said Brent Dichter, vice president, engineering flows, ARM. “The SoC’s design is a key part of the energy-efficiency equation. Giving our semiconductor partners access to our IP through ANSYS’ simulation tools enables them to optimise their designs earlier and allow more time to be spent creating competitive products that smooth their delivery path.”
ANSYS simulation technology will support ARM in its continued development of semiconductor IP and the ARM ecosystem partners design reliable and robust semiconductor chips.ANSYS Redhawk, ANSYS Totem and ANSYS PowerArtist simulation solutions will help with electrostatic discharge, electromigration, power modelling, analysing and validating foundation IP building blocks, as well as central processing units and graphics processing unit cores.
"The combination of ARM’s IP development expertise with ANSYS simulation tools strengthens ARM’s ability to provide world-class energy-efficient IP for various vertical segments of IoT," said Vic Kulkarni, vice president and general manager, ANSYS. “By utilising ANSYS technology, ARM and its ecosystem partners can design smarter and faster chips for electronic devices more easily.”
