According to X-FAB, this will give its customers greater flexibility in choosing the optimal OTP solution for their designs.
This announcement follows a previous one concerning the demonstration and availability of the I-fuse S3 OTP based on 3.3V devices – this new design uses 1.8V devices, reducing the footprint by a factor of four compared to the existing version.
Both versions are available in different memory densities, ranging from 8 bits to 8K x 8 bits (64K bits).
The I-fuse S3 OTP (S3 means ‘super-small’ and ‘scalable’) is an innovation in peripheral design that complements the I-fuse cell technology.
By employing a novel array architecture, it has been possible to achieve a more compact form factor and improved scalability, closely following Moore’s Law for small to medium-sized OTP applications. This innovation is incorporated into X-FAB’s XH018, a modular sensor and high-voltage EPI technology, supporting an extended temperature range from -40°C to 175°C. It features a modular 1.8V/3.3V ultra-low-noise process designed for automotive-grade, industrial, and medical applications.
Above: Layout of 8 kb x 8 OTP with I-fuse S3 memory architecture
“We are pleased with the performance of the XH018 platform,” said Shine Chung, Chairman of Attopsemi. “The high reliability and high-temperature capability of this X-FAB process supports our I-fuse OTP performance. It is very encouraging to see that our collaboration has already triggered new projects with mutual customers in industrial and consumer areas, and that it is starting to support new opportunities in the medical sector as well. With the IP proven functional up to 150°C, it also has the potential to enable additional opportunities in automotive applications.”
“Expanding Attopsemi’s I-fuse IP on our XH018 technology gives our customers more options to integrate and embed proven third-party IP into their designs,” added Nando Basile, Product Marketing Manager for Memory Solutions at X-FAB. “This helps optimise time-to-market while maintaining a cost-effective approach with no mask adders to the X-FAB core process.
“These solutions are a perfect fit for our NVM portfolio, complementing our automotive-focused OTP and multi-programmable solutions like Flash and NVRAM. We’re seeing growing interest in these solutions, especially in industrial, IoT, and medical applications where a small form factor is of paramount importance.”
