This product family is a response to what the company has described as ‘unprecedented demand’ from the aerospace and defence sectors for its Gen 3 high density, high reliability MRAM solutions that are intended to address decades-old system-level challenges.
Avalanche is looking to provide new scalability in support of diverse mission requirements and building on its LEO-targeted Space Grade product line, the new enhanced Space Grade-E device family allows pin compatible scalability to MEO, GEO, and beyond.
Sampling now, this Space Grade-E family offers an enhanced qualification and screening flow above the Space Grade family.
It is offered in both Parallel and Dual QSPI interface types, the enhanced specifications of the Space Grade-E family include a boost in radiation tolerance specs and burn in hours for improved reliability.
Both Space Grade and Space Grade-E families will maintain pin-compatible migration (by interface type) amongst and between them, providing a software-defined hardware platform for evolving mission requirements. These two product families further buttress the recently communicated focus areas, including efficient and reliable boot of advanced SoCs & FPGAs with in-situ multi-mission adaptability and reliable data storage.
"The decades-long gap in NVM solutions with sufficient density, reliability and radiation resilience was so significant that our disruptive Gen 3 products are responsible for changing the conversation throughout the industry from 'What incremental improvement can we hope to make?' to 'What can't we do now?'", said Danny Sabour, VP of Sales & Marketing at Avalanche Technology. "Our modular architecture allows us to rapidly roll out new product variations to meet evolving needs, leveraging proven platforms."
The Gen 3 Space Grade and now Space Grade-E are offered as a standard product in Parallel with asynchronous SRAM-compatible timing and Dual QSPI high speed serial interface in various pin compatible density options from 1Gb to 8Gb.
Designed for High-Reliability with multibit error correction and a 10^16 write cycle endurance, data is always non-volatile.
The devices are offered in small footprint packaging (RoHS-compliant and leaded) and extended operating temperature range (-40°C to 125°C) with JEDEC qualification. There are additional qualification screening and packaging options available through partners.