The industry is seeing a transition from System-on-Chip (SoC) integration to new and innovative SiP methodologies. Employing standardised SiP devices in electronic designs across a wide variety of different applications can simplify the design and development process and speed the time to market. For example, it can deliver benefits including a significant reduction in board real-estate and bill-of-materials (BOM) cost, along with a much-simplified supply chain with the number of discrete parts decreasing from potentially up to 150 components down to a single device.
A key element of the agreement signed with Octavo is exclusivity for Avnet Silica – and worldwide exclusivity for Avnet – for the Xilinx-based OSDZU3 SiP family.
The OSDZU3 SiP family includes Xilinx’s single-package XCZU3 Zynq Ultrascale+ MPSoC, which integrates a ZU3 multiprocessor, plus up to 16GB of LPDDR4 memory, power management circuitry and other necessary components.
The device’s flexible integration means it takes up less than half the space of a discrete solution, while also providing fast access to I/O and the ability to take advantage of all the power modes of the ZU3. In addition, the agreement provides access to many other advanced SiP devices across the whole of the Octavo portfolio.
“System-in-Package technology is an increasingly important tool in the field of electronic design,” said Lucio Fornuto, Director Demand Creation EMEA at Avnet Silica. “Access to Octavo’s innovative solutions will enable our customers to take advantage of significant savings in the product development process, in their supply chains and their overall total cost of ownership.”
Commenting Martin Burgos, Director Business Development at Octavo Systems said, “This agreement augments our strategy to bring our products to an expanded range of customers that can really benefit from our advanced SiP technologies across a wide selection of applications and market sectors.”
