The Bluetooth RF Transceiver IP Cores is silicon proven in the 40nm ULP process and fully compliant with the Bluetooth SIG Standards: Bluetooth Version 5.2, Bluetooth Classic (BR/EDR), Bluetooth Low Energy (BLE) v5.3 & 802.15.4 (ZigBee) implementations.
The IP offers functionality and reliable wireless connectivity for a wide range of applications like headphones, mono/stereo headsets, speakers, and other applications like mPOS systems, and printers, providing seamless performance and enhanced wireless connectivity.
Bluetooth Dual Mode RF Transceiver IP cores have very low power consumption, sensitivity, a Tx power of up to 10dBm, and a very compact IP Core size resulting in a Low silicon cost. The small design takes up little room while giving exceptional RX and TX metrics at a highly optimised area and current.
These RF IP Cores are fully compatible with leading Bluetooth Dual Mode Link Layer, LC3 Codec, Protocol Stack SW Cores available from leading suppliers such as Mindtree & CEVA, etc. as well as integration with proprietary Link Layers.
T2M-IP provides a comprehensive range of Bluetooth IP cores in leading fab/node combinations to enable semiconductor or ASIC companies to develop ultra-low-cost, low-power SoCs for audio applications from high-performance TWS earbuds to ultra-long battery life IOT applications.
These semiconductor IP blocks include Bluetooth Dual-mode v5.3 RF Transceiver IP Cores , BLE v5.3 / 15.4 RF Transceiver IP Cores (0.5mm2) , Bluetooth Dual mode v5.3 Controller Link Layer IP cores, BLE v5.3 Controller Link Layer IP cores, BLE/15.4 Concurrent Controller Link Layer IP cores, Bluetooth Dual mode v5.3 SW Stack & Profiles, BLE v5.3 SW Stack & Profiles, as well as ZigBee MAC & Protocol Stack SW.
High-Accuracy Distance Measurement (HADM) is under development and will be available towards the end of the year.
