Engineering publications brought to you by Mark Allen

Audio technology

xMEMS introduces 1-mm near-field full-range MEMS micro speaker

First BLE and Matter wireless MCU to feature neural co-processor for AI/ML workloads

Same Sky adds compact, surface mount packages to speakers product line

Cadence announces first major toolbox for MATLAB/Simulink Model deployment

Class-D amplifier for in-car audio adds automotive-optimised diagnostics

LDO regulator for high quality audio devices

Revolutionising TWS earbuds with ultrasonic MEMS speakers

POLYN introduces Evaluation Kit for NeuroVoice

NXP introduces latest-generation automotive, AI and ML capable audio DSP technology

XMOS and DSP Concepts partner to unlock audio and voice DSP applications

Dolphin Design announces first silicon tape out in 12nm FinFet

SkyWater Technology to produce POLYN’s first commercial voice processing chip