Breakthrough probing results claimed by imec
In what has been described as an important breakthrough for the semiconductor industry, Belgian research institute imec has partnered with precision measurement specialist Cascade Microtech to successfully probe 25µm diameter micro bumps on a wide I/O test wafer.
The development was made possible through the use of Cascade Microtech's CM300 probe solution, a flexible on-wafer measurement tool designed to deliver superior positioning accuracy and repeatable contact.
The CM300 works by capturing the true electrical performance of devices with high performance capabilities that include low leakage and low noise. Utilising the company's Pyramid Probe technology, it supports both shrinking pad sizes and pitch roadmaps.
"We are excited that our work with Cascade Microtech has resulted in such a breakthrough," said Erik Jan Marinissen, principal scientist at imec. "I believe together we've achieved a first in the industry."
Debbora Ahlgren, vp of Cascade Microtech, added: "Together, [we] are enabling the on-going future of cmos technologies through this groundbreaking work. 3D integration will undoubtedly result in increased performance and yield while reducing overall costs."
