Cu-Diamond is a copper plated diamond composite material that has a high thermal and electrical conductivity. Designed to address the increasingly critical thermal management challenges in advanced semiconductor devices, its described as a cost-effective solution that enables greater performance and reliability for applications such as AI, high-performance computing (HPC), and GaN RF devices.
Managing heat dissipation has become a significant challenge as semiconductor devices have grown larger and more powerful. In fact, more than 50 percent of all electronic device failures are heat-related, and data centres, which today consume 3.7% of total US power demand, are predicted to reach 10% by 2029. As a result, thermal management innovation is critical to enabling next-generation performance and energy efficiency.
“Thermal management for semiconductor devices remains a significant challenge as power levels increase and packaging continues to advance,” said Daniel Twitchen, chief technologist at E6. “Our copper diamond composite addresses these challenges by offering a scalable and affordable solution for next-generation AI and HPC devices. This innovation empowers our customers to enhance performance and reliability, while reducing cooling costs.”
These new copper diamond composites enable exceptional thermal conductivity, in the 800 W/mK range, and are optimised for high-demand applications.
It provides high performance at a lower cost to facilitate widespread adoption and can be manufactured in complex shapes, allowing seamless integration into diverse 2.5/3D advanced packaging configurations.
“Through the unmatched thermal conductivity and durability of diamond-based composites, we are enabling a new era of high-performance devices, not only addressing today’s challenges, but also laying the groundwork for future advancements,” claimed Twitchen.
- Photonics West 2025 takes place at the end of January in San Francisco.
