DFN3020 packaged mosfets reduce board space by 70%

Three dual mosfet combinations have been released, comprising 20 and 30V Nchannel and 30V complementary devices. Diodes says the devices offer a comparable electrical performance as much larger SOT23 packaged parts and can replace two separate SOT23 packaged mosfets to achieve a board space saving of 70%. With a footprint of 6mm² and an off board height of 0.8mm, some 40% less than SOT23 or TSOP-6 packaged parts, the DFN3020 mosfet portfolio is designed for load switch or boost conversion circuits in space constrained, low profile portable consumer electronics including tablets and netbooks. The complementary DFN3020 mosfets will also function as a half bridge for driving motor loads in industrial applications. In addition, the mosfets have a junction to ambient thermal resistance of 83ºC/W allowing for a power dissipation up to 2.4W continuous. Diodes claims the operating temperatures are cooler than achievable with SOT23 packaged mosfets, leading to increased reliability.