Diodes targets power factor correction applications

The DSR6V600P5 and DSR6U600P5 are housed in Diodes' powerDI?5 package. According to the company, it is a thermally efficient low profile small form factor package, which enables the design of thinner and cooler products. The powerDI5 package has an off board profile of 1.1mm and, says Diodes, is 52% thinner than the industry standard DPak, occupying 43% of the board space. It is designed to offer lower thermal resistance (R_thj-c) and to enable higher density designs. The DSR6V600P5 is optimised for use in PFC circuits that operate in continuous conduction mode, and is said to incorporate low reverse recovery time (TMsub>rr) and reverse recovery charge (Q_rr) to ensure that boost diode reverse recovery losses are kept to a minimum. The DSR6U600P5 has been tuned for both low forward voltage drop (V_F) and low T_rr in order to meet the requirements of PFC circuits operating under boundary conduction mode. Diodes says that both devices feature a typical softness factor of 0.7, to enable soft switching with decreased electrical noise that can lead to a reduction of emi shielding and snubber circuits. The high voltage rectifiers are suitable for use in high density switched mode power supplies for led tvs and adaptors, and as recirculation diodes in high intensity discharge lighting applications.