“As an early access partner for the NXP i.MX 93 platform, eInfochips is now offering our clients a cutting-edge reference development platform. This platform enables customers across smart home, smart city and industrial verticals to prototype their ideas and bring them quickly to market”, said Parag Mehta, chief sales, and business development officer at eInfochips.
The EIC-i.MX93-210 is an RDP kit based on NXP’s i.MX 93 applications processor which includes the scalable Arm Cortex-A55 Core, which enables efficient machine learning acceleration and advanced security with an integrated EdgeLock secure enclave to support edge computing.
This RDP has been developed to enable developers to kick-start the development of creating more capable high-performance, cost-effective, and energy-efficient machine learning applications. As engineers progress in product development, eInfochips can provide support that spans across hardware development, firmware, edge-AI enablement, end-to-end design and manufacturing.
The next-generation NXP i.MX 93 processor provides for new use cases and access to a faster, more secure and advanced edge-based system for industrial automation, smart home and intelligent appliances, smart buildings and automotive applications.
“NXP’s i.MX 93 applications processor combines both a level of performance and low power that will enable a wide range of innovative edge devices,” said Jeff Steinheider, vice president and general manager, Industrial Edge, NXP. “eInfochips’ RDP will enable a wide range of customers to rapidly prototype and move into production.”
