embedded world: AMD Fusion to drive congatec’s ETX modules?

The company said it wanted to address the 'major gap' in the market that was left from Intel's decision to discontinue its 885 chipset range, which primarily affected the higher performance range of applications. "This gap has now been closed by processor manufacturer AMD with the Fusion architecture," said the company. "Fusion also opens up new perspectives for a wide range of innovative and graphics oriented applications." As such, congatec will be supporting the Fusion architecture with two new COM modules; the conga-EAF and conga-XAF. Both of the modules run on processors from AMD's G series and are equipped with the Embedded Controller Hub Hudson E1 to provide a powerful and compact two chip solution with up to 4GB of fast single channel ddr3 memory. In addition to the new COM modules, the company also launched the conga-CA6 module and the conga-MCB at embedded world. The conga-CA6 module is based on the new Intel Atom E6xx processor series and the Intel Platform Controller Hub EG20 for COM Express Type 2. With a power consumption of less than 5W and a compact size of 95 x 95mm, the modules are said to be an ideal solution for extreme applications and are specified for the industrial temperature range of -40 to 85°C. According to the manufacturer, the conga-MCB, a mini carrier board for COM Express compact modules, is designed specifically for space critical applications. It is optimised for the quick construction of prototypes, but can also be used for high performance mobile applications. The mini carrier board measures 145 x 95 mm and features four usb ports, a Gigabit Ethernet connection and a graphics interface that includes DisplayPort, HDMI, LVDS, DVI and VGA. It also offers other standard interfaces such as hd audio and mini PCI Express socket which can be used for WLAN. 2x SATA, SD-Card and CFast have been integrated for the connection of mass storage.